Articles from Intel Corporation

Intel Corporation (“Intel”) today announced its intention to separate Intel Capital, its global venture capital arm, into a standalone fund. The new fund will bring Intel Capital’s corporate structure into alignment with other leading venture firms, enabling greater autonomy and the flexibility to attract external capital. Intel will remain an anchor investor in the new company.

Intel Corporation today announced that it will report fourth-quarter and full-year 2024 financial results on Thursday, Jan. 30, 2025, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PST that day to discuss the results.

Subheadline of release dated January 7, 2025 should read: virtual development environment (instead of virtual design environment). First paragraph, second sentence should read: Intel® Automotive Virtual Development Environment (VDE) (instead of Intel® Automotive Virtual Design Environment (VDE)).

Today, at CES 2025, Intel unveiled the new Intel® Core™ Ultra (Series 2) processors, designed to revolutionize mobile computing for businesses, creators and enthusiast gamers. The latest additions to the Intel Core Ultra family feature cutting-edge AI enhancements, increased efficiency and performance improvements.

Intel Corporation today announced that Eric Meurice, former president, chief executive officer and chairman of ASML Holding N.V., and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology Inc., have been appointed to Intel’s board of directors, effective immediately. Both will serve as independent directors.

Intel Corporation (NASDAQINTC) today announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024.

Intel Corporation and the Biden-Harris Administration announced today that the U.S. Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act. The award will support Intel’s previously announced plans to advance critical semiconductor manufacturing and advanced packaging projects at its sites in Arizona, New Mexico, Ohio and Oregon. Intel also plans to claim the U.S. Treasury Department’s Investment Tax Credit, which is expected to be up to 25% of qualified investments of more than $100 billion.

Intel Corporation today announced that company executives will participate in the following investor events:

Intel Corporation today reported third-quarter 2024 financial results.

Intel Corporation today announced that it will report third-quarter 2024 financial results on Thursday, October 31, 2024, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment. To meet this demand head-on, Intel today launched Xeon 6 with Performance-cores (P-cores) and Gaudi 3 AI accelerators, bolstering the company’s commitment to deliver powerful AI systems with optimal performance per watt and lower total cost of ownership (TCO).

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

Intel Corporation today announced that company executives will participate in the following investor events:

Intel Corporation today reported second-quarter 2024 financial results.

Intel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization. Chandrasekaran joins Intel from Micron, where he served as senior vice president for Technology Development. He will be a member of Intel’s executive leadership team and report to CEO Pat Gelsinger.

What’s New: Today, Intel shares exciting details on its collaboration with the International Olympic Committee (IOC) and on an industry-driven generative AI (GenAI) retrieval-augmented generation (RAG) solution. These announcements demonstrate how open AI systems and platforms using Intel® Gaudi® AI accelerators and Intel® Xeon® processors put the power in the hands of developers and enterprises to tackle challenges created by the AI boom.

What’s New: Intel is launching its first U.S. registered apprenticeship program for manufacturing facility technicians in Arizona in collaboration with the Arizona Commerce Authority (ACA), the Phoenix Business and Workforce Development Board, the SEMI Foundation, Maricopa Community Colleges District (MCCD) and Fresh Start Women’s Foundation. The company plans to train facility technician apprentices over the next five years. Selected apprentices will be full-time Intel employees on day one and will earn a certificate and college credit upon successful completion of the one-year program.

What’s New: Intel Corporation has achieved a revolutionary milestone in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel’s Integrated Photonics Solutions (IPS) Group demonstrated the industry’s most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU and running live data. Intel’s OCI chiplet represents a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI infrastructure for data centers and high performance computing (HPC) applications.

Intel Corporation (Nasdaq: INTC) and Apollo (NYSEAPO) today announced a definitive agreement under which Apollo-managed funds and affiliates will lead an investment of $11 billion to acquire from Intel a 49% equity interest in a joint venture entity related to Intel’s Fab 34.

Today at Computex, Intel unveiled cutting-edge technologies and architectures poised to dramatically accelerate the AI ecosystem – from the data center, cloud and network to the edge and PC. With more processing power, leading-edge power efficiency and low total cost of ownership (TCO), customers can now capture the complete AI system opportunity.

Intel Corporation today announced that company executives will participate in the following investor events:

Intel Corporation today announced the appointment of Kevin O’Buckley as senior vice president and general manager of Foundry Services, the customer service and ecosystem operations division of Intel Foundry. O’Buckley starts today and becomes a member of Intel’s executive leadership team reporting to CEO Pat Gelsinger. He succeeds Stuart Pann, who will retire from Intel after 35 years of service at the end of May and remain an adviser to support a seamless transition.

Intel Corporation today reported first-quarter 2024 financial results.

At the Intel Vision 2024 customer and partner conference, Intel introduced the Intel Gaudi 3 accelerator to bring performance, openness and choice to enterprise generative AI (GenAI), and unveiled a suite of new open scalable systems, next-gen products and strategic collaborations to accelerate GenAI adoption. With only 10% of enterprises successfully moving GenAI projects into production last year, Intel's latest offerings address the challenges businesses face in scaling AI initiatives.

Intel Corporation today announced that it will report first-quarter 2024 financial results on Thursday, April 25, 2024, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

Intel Corporation today outlined a new financial reporting structure that is aligned with the company’s previously announced foundry operating model for 2024 and beyond. This new structure is designed to drive increased cost discipline and higher returns by providing greater transparency, accountability and incentives across the business.

The Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.

Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.

Join Intel experts for panel discussions and talks at this year’s Open Confidential Computing Conference (OC3), a virtual event on March 13. Hosted by Edgeless Systems, OC3 is the premier event for security architects, cloud-native software engineers, IT security experts, CISOs, CTOs, security researchers and developers who want to learn about confidential computing.

Intel Corporation today announced that it will hold an investor webinar at 1:30 p.m. PDT on April 2, 2024, to present the vision and financial framework for the Intel Foundry business, including the recast financials and new segment reporting structure aligned with its transition to an internal foundry model. Pat Gelsinger, Intel’s chief executive officer, and David Zinsner, executive vice president and chief financial officer, will present at the session.

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel® Core™ Ultra processors and the AI PC, and more.

Intel Corporation today announced that David Zinsner, executive vice president and chief financial officer, will participate in a fireside chat on Intel’s business and financial strategy at the Morgan Stanley Technology, Media, and Telecom Conference on March 6, 2024, at 10:15 a.m. PST.

Intel announced today that it will provide updates on its foundry business and process roadmap at IFS Direct Connect, Intel’s flagship foundry customer event on Feb. 21 in San Jose, California.

At MWC Barcelona 2024, Intel will demonstrate breakthrough innovations across a full spectrum of new hardware, software and services – bringing AI Everywhere – for the network, edge and enterprise in collaboration with the support and enablement of more than 65 pioneering customers and partners.

Intel Corporation today reported fourth-quarter and full-year 2023 financial results.

Intel Corporation today announced that it will report fourth-quarter and full-year 2023 financial results on Thursday, Jan. 25, 2024, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PST that day to discuss the results.

Intel Corporation today announced the appointment of Justin Hotard as executive vice president and general manager of its Data Center and AI Group (DCAI), effective Feb. 1. He joins Intel with more than 20 years of experience driving transformation and growth in computing and data center businesses, and is a leader in delivering scalable AI systems for the enterprise.

Intel Corporation today announced that Sachin Katti, senior vice president and general manager of the Network and Edge Group (NEX), will participate in a fireside chat on NEX’s business and strategy at Barclays Global Technology, Media and Telecommunications Conference on Dec. 6, 2023, at 1:20 p.m. PST.

Intel Corporation today announced that it will report third-quarter 2023 financial results on Thursday, Oct. 26, 2023, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

Intel Corporation today announced its intent to separate its Programmable Solutions Group (PSG) operations into a standalone business. This will give PSG the autonomy and flexibility it needs to fully accelerate its growth and more effectively compete in the FPGA industry, which serves a broad array of markets, including the data center, communications, industrial, automotive, aerospace and defense sectors. Intel also announced that Sandra Rivera, executive vice president at Intel, will assume leadership of PSG as chief executive officer; Shannon Poulin has been named chief operating officer.

Intel today celebrated the arrival of its Intel 4 technology, which uses extreme ultraviolet (EUV) technology, and the first use of EUV in high-volume manufacturing (HVM) in Europe. The arrival of this important moment ushers in the future for products like Intel’s upcoming Intel® Core™ Ultra processors (code-named Meteor Lake), which will pave the way for AI PCs, as well as future-generation Intel® Xeon® processors coming in 2024 and produced on the Intel 3 process node.

Intel Corporation today announced that it has agreed to sell an approximately 10% stake in the IMS Nanofabrication business (“IMS”) to TSMC. TSMC’s investment values IMS at approximately $4.3 billion, consistent with the valuation of the recent stake sale to Bain Capital Special Situations (“Bain Capital”). Intel will retain majority ownership of IMS, which will continue to operate as a standalone subsidiary under the leadership of CEO Dr. Elmar Platzgummer. The transaction is expected to close in the fourth quarter of 2023.

Intel Foundry Services (IFS) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally. Under the agreement, Tower will utilize Intel’s advanced manufacturing facility in New Mexico. Tower will invest up to $300 million to acquire and own equipment and other fixed assets to be installed in the New Mexico facility, providing a new capacity corridor of over 600,000 photo layers per month for Tower’s future growth, enabling capacity to support forecasted customer demand for 300mm advanced analog processing.

Intel Corporation (Nasdaq: INTC) today announced that it has mutually agreed with Tower Semiconductor (Nasdaq: TSEM) to terminate its previously disclosed agreement to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022.​ In accordance with the terms of the merger agreement and in connection with its termination, Intel will pay a termination fee of $353 million to Tower.

Intel (Nasdaq: INTC) and Synopsys (Nasdaq: SNPS) announced that they have entered into a definitive agreement to expand the companies’ long-standing IP (intellectual property) and EDA (electronic design automation) strategic partnership with the development of a portfolio of IP on Intel 3 and Intel 18A for Intel’s foundry customers. The availability of key IP on Intel advanced process nodes will create a more robust offering for new and existing Intel Foundry Services (IFS) customers.

Intel Corporation today announced that company executives will participate in the following investor events:

The following is an opinion editorial by Al Thompson, vice president of U.S.-Canada Government Affairs for Intel Corporation:

Today, Intel announced a strategic collaboration agreement with Ericsson to utilize Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.

What's New: Intel now offers a set of 34 open source AI reference kits to the community, the result of a yearslong collaboration with Accenture, enabling developers and data scientists to deploy artificial intelligence (AI) faster and more easily. Each kit includes model code, training data, instructions for the machine learning pipeline, libraries and oneAPI components to optimize AI and make it accessible to organizations in multiarchitecture on-premises, cloud and edge environments.

What’s New: Today, Intel announced it has agreed to a term sheet with ASUS, a global technology solution provider, for an agreement to manufacture, sell and support the Intel® Next Unit of Compute (NUC) 10th to 13th generations systems product line and to develop future NUC systems designs.

Intel Corporation today announced that it will report second-quarter 2023 financial results on Thursday, July 27, 2023, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

Intel Corporation today announced that it has agreed to sell an approximately 20% stake in its IMS Nanofabrication GmbH (“IMS”) business to Bain Capital Special Situations (“Bain Capital”), in a transaction that values IMS at approximately $4.3 billion. The transaction is expected to close in the third quarter of 2023. IMS will operate as a standalone subsidiary and will continue to be led by CEO Dr. Elmar Platzgummer.

Intel and the German federal government have signed a revised letter of intent for Intel’s planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt state in Germany. The agreement encompasses Intel’s expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities (also known as “fabs”) in Europe, along with increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced.

Intel today announced that it has selected an area near Wrocław, Poland, as the site of a new cutting-edge semiconductor assembly and test facility. This facility will help meet critical demand for assembly and test capacity that Intel anticipates by 2027. Intel expects to invest up to $4.6 billion in the facility, which will have the capacity to expand. When completed, the facility will support approximately 2,000 Intel employees. The construction of the facility is also expected to create several thousand more jobs, in addition to eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval.

What’s New: Today, Intel announced the release of its newest quantum research chip, Tunnel Falls, a 12-qubit silicon chip, and it is making the chip available to the quantum research community. In addition, Intel is collaborating with the Laboratory for Physical Sciences (LPS) at the University of Maryland, College Park’s Qubit Collaboratory (LQC), a national-level Quantum Information Sciences (QIS) Research Center, to advance quantum computing research.

Intel Corporation today announced it will hold an investor webinar at 8:30 a.m. PDT on June 21, 2023, to provide an update on the company’s internal foundry model. David Zinsner, executive vice president and chief financial officer, and Jason Grebe, corporate vice president and general manager of Corporate Planning, will discuss how Intel’s internal foundry model is designed to shift the way the company operates and drive a more efficient cost structure.

What’s New: Intel is the first in the industry to implement backside power delivery on a product-like test chip, achieving the performance needed to propel the world into the next era of computing. PowerVia, which will be introduced on the Intel 20A process node in the first half of 2024, is Intel’s industry-leading backside power delivery solution. It solves the growing issue of interconnect bottlenecks in area scaling by moving power routing to the backside of a wafer.

At the ISC High Performance Conference, Intel showcased leadership performance for high performance computing (HPC) and artificial intelligence (AI) workloads; shared its portfolio of future HPC and AI products, unified by the oneAPI open programming model; and announced an ambitious international effort to use the Aurora supercomputer to develop generative AI models for science and society.

Technology is increasingly central to every aspect of human existence. It has the potential to unlock powerful new possibilities, such as helping people hear what they wouldn't be able to hear on their own.

Intel and SAP SE today announced a strategic collaboration to deliver more powerful and sustainable SAP® software landscapes in the cloud. Designed to help customers derive greater scalability, agility and consolidation of existing SAP software landscapes, the collaboration deepens Intel’s focus on delivering extremely powerful and secure instances for SAP, powered by 4th Gen Intel® Xeon® Scalable processors.

The following is an opinion editorial by Jackie Sturm, corporate vice president of Global Supply Chain Operations at Intel Corporation:

The following is an opinion editorial from Pat Gelsinger, chief executive officer of Intel Corporation:

Intel Corporation today announced that company executives will participate in the following investor events:

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm® customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS’s robust manufacturing footprint that includes U.S.- and EU-based capacity.

Intel Corporation today announced that it will report first-quarter 2023 financial results on Thursday, April 27, 2023, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

Intel and the Gordon and Betty Moore Foundation announced today that company co-founder Gordon Moore has passed away at the age of 94.

Intel Corporation today announced the appointment of Stuart Pann as senior vice president and general manager of Intel Foundry Services (IFS), Intel’s commercial foundry business. Pann will report to Intel CEO Pat Gelsinger and drive continued growth for IFS and its differentiated systems foundry offering, which goes beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.

What’s New: Today, Intel announced that the LF AI & Data Foundation Technical Advisory Council accepted Open Federated Learning (OpenFL) as an incubation project to further drive collaboration, standardization and interoperability. OpenFL is an open source framework for a type of distributed AI referred to as federated learning (FL) that incorporates privacy-preserving features called confidential computing. It was developed and hosted by Intel to help data scientists address the challenge of maintaining data privacy while bringing together insights from many disparate, confidential or regulated data sets.

Intel Corporation today announced it will hold an investor webinar at 8:30 a.m. PDT on March 29, 2023, to provide an update on the company’s Data Center and AI business and its growth drivers, and to review its data center product roadmap. Sandra Rivera, executive vice president and general manager of the Data Center and AI Group, will present at the event.

What’s New: After launching its beta version in September 2022, Intel today released version 1.0 of the Intel® Quantum Software Development Kit (SDK). The SDK is a full quantum computer in simulation that can also interface with Intel’s quantum hardware, including Intel’s Horse Ridge II control chip and Intel’s quantum spin qubit chip when it becomes available this year. The kit allows developers to program quantum algorithms in simulation, and it features an intuitive programming interface written in C++ using an industry-standard low-level virtual machine (LLVM) compiler toolchain. As a result, Intel’s SDK offers seamless interfacing with C/C++ and Python applications, making it more versatile and customizable.

For more than a decade, Intel and its partners have been on a mission to virtualize the world’s networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Intel Corporation today announced that its board of directors has reset its dividend policy, reducing the quarterly dividend to $0.125 per share (or $0.50 annually) on the company’s common stock. The dividend will be payable on June 1, 2023, to stockholders of record on May 7, 2023. Intel also reaffirmed its first-quarter 2023 business outlook provided at its most recent earnings call, including revenue of between $10.5 billion and $11.5 billion; gross margin of 34.1% on a GAAP basis and 39% on a non-GAAP basis; tax rate of (84%) on a GAAP basis and 13% on a non-GAAP basis; and earnings per share of $(0.80) on a GAAP basis and $(0.15) on a non-GAAP basis.1

Intel Corporation today announced that David Zinsner, executive vice president and chief financial officer, will participate in fireside chats to discuss Intel’s business and financial strategy at the following investor events:

The following is an opinion editorial by Ilke Demir of Intel Corporation:

What’s New: Intel and the University of California, San Diego (UC San Diego) announced today that they have been selected to join the Hardening Development Toolchains Against Emergent Execution Engines (HARDEN) program team for the Defense Advanced Research Projects Agency (DARPA). Adversaries have crafted increasingly complex cyberattacks in reaction to decades of platform hardening efforts and increasing IT security measures that reduce vulnerabilities. Attempts to mitigate these threats have fallen short, creating an increased risk of intrusion into current and legacy code.